Inside the Memory Tech Powering Today’s AI and HPC Workloads
Release Date: 01/30/2026
Inside the Memory Tech Powering Today’s AI and HPC Workloads
Six Five Media
AI and HPC are outgrowing yesterday’s memory architectures, and the next performance breakthroughs won’t come from GPUs alone. How are memory and storage innovations reshaping how data centers scale for the AI era? From SC25, host , Global Technology Advisor at , is joined by 's , Vice President and General Manager, AI Solutions for Micron’s Cloud Memory Business Unit, for a conversation on the advanced memory technologies driving efficiency, bandwidth, and scalability for AI and HPC workloads. The discussion brings practical insights into the real-world implications of memory...
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Six Five Media
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Six Five Media
How does AWS turn groundbreaking scientific research into cutting-edge cloud services powering global businesses? From AWS re:Invent 2025, host is joined by 's , VP, Agentic AI, for a conversation on the innovation process at AWS. Their discussion provides insight into the “AWS innovation engine” and how AWS transforms research into market-ready services. Key Takeaways Include: 🔹Concept to Launch: Swami outlines the rapid journey of Amazon Quick Suite from a research idea to a customer-facing service. 🔹Innovation Framework: Learn how AWS evaluates new research and...
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The View from Davos with Check Point CEO Nadav Zafrir
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The Main Scoop Episode 39: Fostering Learning Agility and Curiosity - How to Empower Today’s Developers
Six Five Media
How do enterprises responsibly modernize, optimizing developer experience (DevX) with the latest tooling and AI, while maintaining the security and reliability of mission-critical systems? On this episode of The Main Scoop, hosts , SVP & GM, Mainframe Software Division, Broadcom, and , CEO and Chief Analyst, Futurum, are joined by Group’s , VP and Engineering Practice Owner, and DevSecOps Executive Product Owner and Technology Lead, to explore how enterprises like TD Bank are empowering developers through modern AI tools, evolving culture, and practical modernization while meeting the...
info_outlineAI and HPC are outgrowing yesterday’s memory architectures, and the next performance breakthroughs won’t come from GPUs alone. How are memory and storage innovations reshaping how data centers scale for the AI era?
From SC25, host David Nicholson, Global Technology Advisor at Futurum, is joined by Micron's Girish Cherussery, Vice President and General Manager, AI Solutions for Micron’s Cloud Memory Business Unit, for a conversation on the advanced memory technologies driving efficiency, bandwidth, and scalability for AI and HPC workloads. The discussion brings practical insights into the real-world implications of memory bottlenecks and emerging architectures and interconnects shaping next-gen data center performance. What evolving strategies around composable infrastructure are helping data center architects plan for memory-intensive computing?
Key Takeaways Include:
🔹Memory bottlenecks in AI and HPC: Why memory architectures are now the critical limiting factor in AI/HPC system performance and scaling.
🔹Emerging solutions and trade-offs: How higher bandwidth, increased capacity, new module designs, and innovative interconnects are addressing performance needs, and the challenges and roadblocks system designers still face.
🔹Modular, composable, and CXL-driven infrastructure: The practical benefits of modular and composable memory, and how technologies like CXL are enabling more dynamic, agile, and efficient memory use for modern workloads.
🔹Real-world benchmarking & ecosystem collaboration: Insights from industry-standard benchmarks and testing with partners, revealing how latency and bandwidth behave under authentic AI/HPC conditions.
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