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Inside a Multi-$Billion IP Engine Driving IC and EDA Innovations

Moore's Lobby: Where engineers talk all about circuits

Release Date: 09/22/2026

Inside a Multi-$Billion IP Engine Driving IC and EDA Innovations show art Inside a Multi-$Billion IP Engine Driving IC and EDA Innovations

Moore's Lobby: Where engineers talk all about circuits

The semiconductor landscape is changing faster than ever. Chips now power everything from AI to advanced automotive systems. At the heart of this rapid revolution is semiconductor intellectual property (IP). In this episode, Daniel Bogdanoff sits down with John Koeter of Synopsys. They explore how pre-verified silicon blocks accelerate chip design. They also discuss the massive shift toward multi-die systems and the future role of AI in engineering.   Accelerating Chip Design with Pre-Verified IP and Multi-Die Architectures As Moore's law slows down, chip designers face extreme physical...

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Moore's Lobby: Where engineers talk all about circuits

Joaquin Torrecilla began his engineering career programming a Sinclair Spectrum in Basic and Assembler. He later tested some of the industry's very first commercial Bluetooth solutions. Today, he remains at the forefront of RF and protocol testing. In this episode, Joaquin shares key insights from his 20 years with the 3GPP RAN Plenary. He also discusses the complex balance required to create and certify global wireless testing standards. The conversation dives deep into the game-changing capabilities of 5G Advanced. Joaquin breaks down the impact of: Network Slicing: Customizing virtual...

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Moore's Lobby: Where engineers talk all about circuits

In this insightful interview, embedded computing pioneer Christian Eder sits down with host Daniel Bogdanoff to explore the past, present, and future of modular systems design. As a co-founder of congatec, Christian draws on over 30 years of industry experience to highlight how Computer-on-Modules (COMS) have transformed modern electronics. Christian discusses the strategic decisions that fueled congatec's growth into a leading board manufacturer and outlines why standardizing technology benefits the entire ecosystem. He details the development and roll-out of critical open standards,...

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Moore's Lobby: Where engineers talk all about circuits

In this fascinating interview, Sergiy Nesterenko details the journey that ultimately drove him to solve a critical bottleneck in hardware engineering: the manual, slow process of printed circuit board (PCB) layout. In his discussion with our Moore’s Lobby host, Daniel Bogdanoff, Sergiy shares engaging anecdotes from his early career, including a SpaceX internship where he was assigned to literally watch paint dry. He also describes his first attempt at PCB layout at SpaceX, where a power switch board caught fire in his hands. This experience fueled his desire to bring robust automation to...

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Moore's Lobby: Where engineers talk all about circuits

In the engineering world, we rely on sensors to acquire data from real-world processes and machines. Deciding how to use that data is very important. The right decisions impact process efficiency, system reliability, and even worker safety.   Join Control.com’s David Peterson as he chats with Kate Sokolnicki of Rockwell Automation in this episode of the Moore’s Lobby podcast. Sokolnicki explains the evolution of industrial sensing and the shift toward data-driven manufacturing.  They discuss many key technological advancements, including: -IO-Link as a standard: Simple...

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Moore's Lobby: Where engineers talk all about circuits

The "old school" way was simple: a sensor sees a part, tells the controller, and the actuator moves. It was pure hardware logic, and it worked. But in today’s smart factories, that’s only half the story. Modern sensors aren't just on/off switches anymore—they are eyes and ears, and sometimes even the brains, of the automation. However, surprisingly few engineers really understand both the hardware and software sides of machine data. In this episode of the Moore’s Lobby podcast, ’s David Peterson discusses sensors with Nils Beckmann, an expert with a background in both sensor hardware...

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Moore's Lobby: Where engineers talk all about circuits

Automation engineers have heard a lot about condition monitoring in recent years as one of the most common examples of how AI and digital transformation are actually hitting the ground with real results for industry. Sensing is certainly the foundation of the process, but it requires the proper mix of equipment and know-how to move from a simple project to a fully scaled-up implementation. In this episode of the Moore’s Lobby podcast, ’s David Peterson visits Salim Dabbous, the Director of Consulting & Digital Solutions at SICK. Salim has a broad background that includes working with...

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Moore's Lobby: Where engineers talk all about circuits

In this episode of the Moore’s Lobby podcast, we sit down with Antonio Di Vaira, Senior VP for Power Product of Schneider Electric to discuss the massive shifts happening in the world of energy distribution. The conversation kicks off by exploring how the explosive growth of electric vehicles and energy-hungry technologies like AI are pushing traditional power grids to their breaking point. He also explains that while building out new grid capacity is part of the long-term solution, the industry needs ways to sustain this growth in the short term. This sets the stage for a deep dive into...

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Moore's Lobby: Where engineers talk all about circuits

Technologists and leaders will be interested in hearing Mike explain how 3M's R&D culture that emphasizes collaborative problem-solving. They continue to leverage their "15% time" philosophy to fosters creative solutions that are being applied to our rapidly electrifying world. If you're passionate about how fundamental material science is enabling breakthrough innovation in the electrical engineering world, this is an episode you don't want to miss.  : -The Surprising Role of Adhesives and Tapes: A look at how 3M's advanced materials are critical components in everything from wind...

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Moore's Lobby: Where engineers talk all about circuits

Dr. Mital Kanabar is the Senior Director of Innovation, Grid Automation, Grid Solutions at GE Vernova. He joins our podcast to discuss the explosive electricity demand driven by electric vehicles, AI data centers, and the general electrification of industries. This increased demand puts a strain on an aging infrastructure, necessitating new solutions to ensure a reliable and resilient power supply. Check out this engaging conversation that touches on a number of important topics, including: Decarbonization and Green Electrons: The push to generate electricity from renewable sources like wind,...

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More Episodes

The semiconductor landscape is changing faster than ever. Chips now power everything from AI to advanced automotive systems. At the heart of this rapid revolution is semiconductor intellectual property (IP).

In this episode, Daniel Bogdanoff sits down with John Koeter of Synopsys. They explore how pre-verified silicon blocks accelerate chip design. They also discuss the massive shift toward multi-die systems and the future role of AI in engineering.

 

Accelerating Chip Design with Pre-Verified IP and Multi-Die Architectures

As Moore's law slows down, chip designers face extreme physical challenges. Designing a complex system-on-chip (SoC) from scratch is no longer viable. Companies rely on proven IP blocks to speed up time-to-market and ensure silicon success.

Today, the industry is transitioning to multi-die systems. Instead of one massive chip, designers stack multiple specialized chiplets in advanced packages. This transition introduces complex thermal and power challenges that require highly accurate modeling.

  • System on a Chip (SoC): An integrated circuit that combines all necessary electronic circuits and parts on a single chip.

  • Multi-Die Systems (Chiplets): An architecture where multiple specialized dies are combined in a single package to maximize performance.

  • Model to Hardware Correlation (MHC): The practice of ensuring pre-silicon simulation models accurately predict real-world post-silicon behaviors.

Managing thermal distribution is the biggest hurdle in 3D IC design. Stacking chips creates intense hotspots. These hotspots can crack or delaminate packages if unmanaged. Engineers must use advanced simulation tools to model these thermal characteristics early in the design cycle.